OCZ Intros ReaperX Heatspreaders

Rob Williams

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From our front-page news:
Last year, it would be rare to go a month without seeing a handful of new heatspreaders from various manufacturers. All of them shared the same goal... to better cool your memory modules. To date, we've never seen a heatspreader that hurt performance, but it's rare to see one that actually makes a notable improvement.

OCZ's latest ReaperX series might be one of those rare kits, however. Similar to their Reaper series, which we've taken a look at in the past, the modules have base spreaders that allow heat to run along a heatpipe to the top where it dissipates. ReaperX takes things to a new level, by having the heatpipes closer to the memory chips, and also by including a fin array at the top which should prove better heat dissipation overall. Whether or not you choose to use a fan, these should be appropriate for overclocking. Well... if the chips themselves will cooperate.

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Sunnyvale, CA-November 6, 2007-
OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced the ReaperX memory series, an innovative memory solution that utilizes highly effective heat transfer technology. Re-engineering the Reaper HPC (Heat Pipe Conduit) design, the DDR2 PC2-6400 ReaperX uses a dual metal heatpipe formation to effectively offload heat and increase stability of memory modules. The unique ReaperX heatspreader is designed to deliver superior heat dissipation that is more effective than traditional heatspreaders.

Source: OCZ Press Release
 
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