Well, it's the fault of the FBGA chips really. They are designed for good thermal dissipation, but they are not as secured to the PCB like the old style TSOP chips were.
You -can- give it a shot if you want, although I don't recommend it. These modules especially, since the spreader is more elaborate than others, it might just not come apart that easily. Each side of the spreader is glued together (I assume it's glue) and because of this, I think if you tried to break the spreader apart, you'd do more damage than if you had a regular kit.
Although I've never done it, the XTC spreaders would be far more easier to take off. The best way would be to bench them for a while so they get real warm, then haul them out and tear them off.
Again, I don't recommend this at all, but if you are a daredevil, you can give it a shot. It's just far too easy to kill kits this way. Impossible to RMA after that as well ;-) As far as I know, Team Xtreem is the only company that offers enthusiast modules without spreaders already pre-installed.